| May 2011, the company introduced a BGA rework station ZM-R680C have been tested and acceptance. The introduction of the device, to achieve a single piece BGA Rework of BGA soldering and disassembly process, bumping, mounting, welding intelligent control of the whole process, the range can handle PCB size Max 370 × 430mm Min 10 × 20 mm, chip range 2X2 -80X80mm and Lead Socket775 and double BGA / CGA / IC and various shielding devices such as rework, greatly improved the company BGA rework processing capacity, enhanced customer confidence. |
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