1、PCBA Manufacturing Technology (Manufacturing technology) and IT products entire program (SMT + THT + DE + Assy + AT) production services;

a.Equipment capacity: a high-precision MPM, GKG other automatic solder paste printer, and steady SIEMENS SIPLACE processing clusters and lead-free reflow oven.

b.Can mount range: PCB thickness (H) 0.5-4.5mm, L * W (L * W) 50mm * 50mm 460mm * 460mm (special sizes can be achieved through the fixture), electronic components, package size 0402-55mm * 55mm, height 15mm within (including BGA, Flip Chip, SO to SO32, TSOP, DRAM, Fine-picth QFP, CSP and PLCC, etc.) for placement.

c.Process Capability: professional production process design; rich BGA, Fine-Pitch QFN, QFP, CSP, PLCC, and 0402,0201 chip component soldering technical experience; provide improved product design rationalization program; meet IPC-A -610E standard and lead-free process technology.

d.Process control: in strict accordance with GB / T 19001-2008/ISO9001: 2008 quality management system requirements, IECQ HSPM QC080000: 2005 Hazardous Substance Process Management System Requirements document management system to establish effective control and standardization of operations; and using ASPM , LSPI, X-RAY, AOI, EM and other equipment on the manufacturing process key process control.

2、Program evaluation component selection and procurement, supply chain optimization management;

3、Engineering products;

4、Comply with EU 2002/95/EC RoHS Directive "green products" production;

5、Providing 3C products factory quality assurance capability for service;

6、Product Traceability system established;

7、Providing RFID infrastructure products;

8、OEM / ODM service;

9、IMP / EXP business processes.